Korea Joongang Daily on MSN14d
LG Innotek starts mass production of FC-BGA chip substrate for U.S. clients
LG Innotek has begun mass production of its flip chip ball grid array semiconductor substrate for U.S. clients.
Design-Reuse1mon
Actel Introduces Land Grid Array Packaging Option for Radiation-Tolerant RTAX-S FPGA Family
announced it has expanded its package selection to include a Land Grid Array (LGA) option for its RTAX-S field-programmable gate array (FPGA) family. With this package, military and aerospace ...